Ira A. Fulton Schools of Engineering | Engineering Technical Services

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Information is provided ‘as is’ without warranty of any kind. We recommend using it on a copy of your data to be sure you understand what it does under your conditions. Keep your master intact until you are satisfied with the use of this information within your environment.

 

Cadence products used in classes in the ECEE Department

 

Custom Integrated Circuits Bundle:

  • EEE 433: Analog Integrated Circuits
  • EEE 523: Advanced Analog Integrated Circuits
  • EEE 524: Communications Transceiver Circuits Design
  • EEE 525: VLSI Design
  • EEE 527: Analog to Digital Converters

Digital Integrated Circuits Bundle:

  • EEE 425: Digital Systems and Circuits
  • EEE 433: Analog Integrated Circuits
  • EEE 525: VLSI Design
  • EEE 527: Analog to Digital Converters

Verification Bundle:

  • EEE 517 Hardware Design Languages
  • EEE 525: VLSI Design

Silicon-Package-Board Bundle

 

Cadence products used in research in the ECEE Department

 

Custom Integrated Circuits Bundle:
Connection One: Integrated Circuits, Systems, and Sensors Research
WINTech: Standard of living improved through small highly integrated electrical and electro-mechanical systems

Digital Integrated Circuits Bundle:
Connection One: Integrated Circuits, Systems, and Sensors Research
WINTech: Standard of living improved through small highly integrated electrical and electro-mechanical systems

Verification Bundle:
Connection One: Integrated Circuits, Systems, and Sensors Research
WINTech: Standard of living improved through small highly integrated electrical and electro-mechanical systems

 

Cadence products used in research in the Polytechnic School

 

Silicon-Package-Board Bundle:

  • EGR 304: Embedded System Design Project I
  • EGR 305: Robotics Systems Project I
  • EGR 314: Embedded System Design Project II
  • EGR 315: Robotics Systems Project II

 


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Contact information for this website: kmwright@asu.edu

Date last updated: November 1, 2017